Method of forming semiconductor device package having dummy devices on a first die

ABSTRACT

In an embodiment, a method includes: stacking a plurality of first dies to form a device stack; revealing testing pads of a topmost die of the device stack; testing the device stack using the testing pads of the topmost die; and after testing the device stack, forming bonding pads in the topmost die, the bonding pads being different from the testing pads.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a division of U.S. patent application Ser. No.16/023,504, entitled “Semiconductor Device Package and Method,” filed onJun. 29, 2018, which application is incorporated herein by reference.

BACKGROUND

Since the development of the integrated circuit (IC), the semiconductorindustry has experienced continued rapid growth due to continuousimprovements in the integration density of various electronic components(i.e., transistors, diodes, resistors, capacitors, etc.). For the mostpart, these improvements in integration density have come from repeatedreductions in minimum feature size, which allows more components to beintegrated into a given area.

These integration improvements are essentially two-dimensional (2D) innature, in that the area occupied by the integrated components isessentially on the surface of the semiconductor wafer. The increaseddensity and corresponding decrease in area of the integrated circuit hasgenerally surpassed the ability to bond an integrated circuit chipdirectly onto a substrate. Interposers have been used to redistributeball contact areas from that of the chip to a larger area of theinterposer. Further, interposers have allowed for a three-dimensional(3D) package that includes multiple chips. Other packages have also beendeveloped to incorporate 3D aspects.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a cross-sectional view of an integrated circuit device, inaccordance with some embodiments.

FIGS. 2A through 2L are various views of intermediate steps during aprocess for forming device packages, in accordance with someembodiments.

FIG. 3 is a cross-sectional view of a dummy device, in accordance withsome embodiments.

FIG. 4A through 4D are plan views of alignment marks, in accordance withvarious embodiments.

FIGS. 5A through 5J are various views of intermediate steps during aprocess for forming device packages, in accordance with someembodiments.

FIGS. 6A and 6B illustrate variations of the device packages, inaccordance with various embodiments.

FIGS. 7A through 7C are top-down views showing a device stack atdifferent stages of manufacturing, in accordance with variousembodiments.

FIGS. 8A through 8C are plan views of a layer of a device package, inaccordance with some embodiments.

FIGS. 9A through 9H are various views of intermediate steps during aprocess for forming device packages, in accordance with someembodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

According to some embodiments, a device stack is formed on a carriersubstrate. The device stack may be, e.g., a memory cube comprisingmultiple memory dies. The device stack is then removed from the carriersubstrate, and tested using dedicated testing pads. Only known gooddevice stacks are used for subsequent processing, which may increasemanufacturing yield. Further, in some embodiments, dummy devices areadded to the layers of the device stack. The dummy devices may improvethe thermal dissipation of the device stack. Finally, in someembodiments, the dummy devices include alignment marks. By using thedummy devices for alignment, alignment marks may be omitted from thedies of the device stack, which may increase the available routing areaof the dies.

FIG. 1 is a cross-sectional view of an integrated circuit device 50, inaccordance with some embodiments. The integrated circuit device 50 maybe a logic die (e.g., central processing unit (CPU), graphics processingunit (GPU), system-on-a-chip (SoC), microcontroller, etc.), a memory die(e.g., dynamic random access memory (DRAM) die, static random accessmemory (SRAM) die, etc.), a power management die (e.g., power managementintegrated circuit (PMIC) die), a radio frequency (RF) die, a sensordie, a micro-electro-mechanical-system (MEMS) die, a signal processingdie (e.g., digital signal processing (DSP) die), a front-end die (e.g.,analog front-end (AFE) dies), the like, or a combination thereof. Theintegrated circuit device 50 may be formed in a wafer (not shown), whichmay include different device regions that are singulated in subsequentsteps to form a plurality of integrated circuit devices 50. Theintegrated circuit devices 50 will be stacked to form a device packagein subsequent processing. The integrated circuit device 50 includes asubstrate 52, conductive vias 54, an interconnect structure 56, testingpads 58, a dielectric layer 60, bonding pads 62, and conductive vias 64.

The substrate 52 may include a bulk semiconductor substrate,semiconductor-on-insulator (SOI) substrate, multi-layered semiconductorsubstrate, or the like. The semiconductor material of the substrate 52may be silicon, germanium, a compound semiconductor including silicongermanium, silicon carbide, gallium arsenic, gallium phosphide, indiumphosphide, indium arsenide, and/or indium antimonide; an alloysemiconductor including SiGe, GaAsP, AlInAs, AlGaAs, GalnAs, GaInP,and/or GaInAsP; or combinations thereof. Other substrates, such asmulti-layered or gradient substrates, may also be used. The substrate 52may be doped or undoped. Devices (not shown), such as transistors,capacitors, resistors, diodes, and the like, may be formed in and/or onan active surface (e.g., the surface facing upward) of the substrate 52.

The conductive vias 54 are formed to extend into substrate 52 from theactive surface of the substrate 52. In some embodiments, the conductivevias 54, when initially formed, do not extend to a back surface (e.g.,the surface facing downward, opposite the active surface) of thesubstrate 52. The conductive vias 54 are also sometimes referred to asthrough-substrate vias or through-silicon vias (TSVs) when the substrate52 is a silicon substrate. The conductive vias 54 may be formed byforming recesses in the substrate 52 by, for example, etching, milling,laser techniques, a combination thereof, and/or the like. A thindielectric material may be formed in the recesses, such as by using anoxidation technique. A thin barrier layer may be conformally depositedover the active surface of the substrate 52 and in the openings, such asby CVD, ALD, PVD, thermal oxidation, a combination thereof, and/or thelike. The barrier layer may be formed from an oxide, a nitride, or anoxynitride, such as titanium nitride, titanium oxynitride, tantalumnitride, tantalum oxynitride, tungsten nitride, a combination thereof,and/or the like. A conductive material may be deposited over the barrierlayer and in the openings. The conductive material may be formed by anelectro-chemical plating process, CVD, ALD, PVD, a combination thereof,and/or the like. Examples of conductive material are copper, tungsten,aluminum, silver, gold, a combination thereof, and/or the like. Excessof the conductive material and barrier layer is removed from the activesurface of the substrate 52 by, for example, a chemical-mechanicalpolish (CMP). The conductive vias 54 collectively include the barrierlayer and conductive material, with the barrier layer between theconductive material and the substrate 52.

An interconnect structure 56 having one or more dielectric layer(s) andrespective metallization pattern(s) is formed on the active surface ofthe substrate 52, over the conductive vias 54. The dielectric layer(s)may be inter-metallization dielectric (IMD) layers. The IMD layers maybe formed, for example, of a low-K dielectric material, such as undopedsilicate glass (USG), phosphosilicate glass (PSG), borophosphosilicateglass (BPSG), fluorosilicate glass (FSG), SiO_(x)C_(y), Spin-On-Glass,Spin-On-Polymers, silicon carbon material, compounds thereof, compositesthereof, combinations thereof, or the like, by any suitable method knownin the art, such as spinning, chemical vapor deposition (CVD),plasma-enhanced CVD (PECVD), high-density plasma chemical vapordeposition (HDP-CVD), or the like. The metallization pattern(s) in thedielectric layer(s) may route electrical signals between the devices ofthe substrate 52, such as by using vias and/or traces, and may alsocontain various electrical devices, such as capacitors, resistors,inductors, or the like. Further, the conductive vias 54 are electricallyconnected to the metallization patterns. The metallization pattern(s)may be formed from a conductive material such as copper, aluminum, thelike, or combinations thereof. The various devices and metallizationpatterns may be interconnected to perform one or more functions. Thefunctions may include memory structures, processing structures, sensors,amplifiers, power distribution, input/output circuitry, or the like.Additionally, connectors, such as conductive pillars or contact pads,are formed in and/or on the interconnect structure 56 to provide anexternal electrical connection to the circuitry and devices. The aboveexamples are provided for illustrative purposes only, and otherembodiments may utilize fewer or additional elements. Other circuitrymay be used as appropriate for a given application.

The testing pads 58 are a subset of the connectors formed in and/or onthe interconnect structure 56. The testing pads 58 are used insubsequent steps for device testing, and are not electrically connectedor active during normal operation of the integrated circuit device 50.In some embodiments, the testing pads 58 are formed of a lower-costconductive material (e.g., aluminum) than the conductive material of themetallization pattern(s) in the interconnect structure 56.

The dielectric layer 60 covers the testing pads 58 and is over theinterconnect structure 56. The dielectric layer 60 includes one or morelayers of non-photo-patternable dielectric materials such as siliconnitride, silicon oxide, or the like. In some embodiments, the dielectriclayer 60 is subsequently used for bonding, and may be an oxide such assilicon oxide. The dielectric layer 60 may be formed using CVD, PVD,ALD, a spin-on coating process, a combination thereof, or the like.

The bonding pads 62 are formed in the dielectric layer 60 and arephysically and electrically coupled to the interconnect structure 56 bythe conductive vias 64. The bonding pads 62 and conductive vias 64comprise a conductive material, which may be a metallic materialincluding a metal or a metal alloy such as copper, silver, gold,tungsten, cobalt, aluminum, or alloys thereof. In some embodiments, thebonding pads 62 and conductive vias 64 are formed using a dual damasceneprocess. As an example of such a process, openings for the bonding pads62 and conductive vias 64 may be formed in the dielectric layer 60, athin seed layer is deposited in the openings, and the conductivematerial is filled in the openings using, for example, ECP orelectro-less plating from the seed layer. A planarization process, suchas a CMP, may be performed such that top surfaces of the bonding pads 62and dielectric layer 60 are level. In some embodiments, the bonding pads62 and testing pads 58 are formed from different conductive materials.

FIGS. 2A through 2L are various cross-sectional views of intermediatesteps during a process for forming device packages, in accordance withsome embodiments. As will be discussed in greater detail below, FIGS. 2Athrough 2L illustrate a process in which a device stack 102 is formed bystacking multiple first integrated circuit devices, such as theintegrated circuit device 50 illustrated in FIG. 1, and in an embodimentmay be memory dies. The device stack 102 is formed in a top-down (orreverse) manner, where the topmost device of the first integratedcircuit devices 50 is attached face-down to a carrier, and underlyinglayers of the device stack 102 are subsequently attached to the topmostdevice. The device stack 102 is tested after formation to reduce orprevent subsequent processing of known bad die stacks.

Subsequently, the device stack 102 is attached to a second integratedcircuit device 120 (see, e.g., FIG. 2I) to form a first device package100 (see, e.g., FIG. 2I). The second integrated circuit device 120 mayhave a structure similar to the integrated circuit device 50, and in anembodiment may be a logic die. In an embodiment, the first devicepackage 100 is a chip-on-wafer (CoW) package, although it should beappreciated that embodiments may be applied to other 3DIC packages. Asecond device package 150 (see, e.g., FIG. 2L) is then formed bymounting the first device package 100 to a substrate. In an embodiment,the second device package 150 is a chip-on-wafer-on-substrate (CoWoS)package, although it should be appreciated that embodiments may beapplied to other 3DIC packages.

Referring now to FIG. 2A, a bonding layer 106 is deposited on a firstcarrier substrate 104, and a topmost integrated circuit device 50A isattached to the bonding layer 106. The first carrier substrate 104 maybe a glass carrier substrate, a ceramic carrier substrate, a siliconwafer, or the like. Multiple device packages can be formed on the firstcarrier substrate 104 simultaneously. The bonding layer 106 is used forattaching the topmost integrated circuit device 50A to the first carriersubstrate 104. In some embodiments, the first carrier substrate 104 is asilicon wafer. In such embodiments, the bonding layer 106 comprises asilicon-containing dielectric material such as silicon oxide or siliconnitride, and may be formed using CVD, PVD, spin-coating, or the like.The dielectric material may be used for bonding such as oxide-to-oxidebonding, where the dielectric layer 60 of the topmost integrated circuitdevice 50A is bonded to the bonding layer 106. In some embodiments, thefirst carrier substrate 104 is glass. In such embodiments, the bondinglayer 106 comprises a release layer, such as a light-to-heat-conversion(LTHC) release coating, ultra-violet (UV) glue, or the like. The releaselayer may be adhesive and may be used to adhere the topmost integratedcircuit device 50A to the first carrier substrate 104. The topmostintegrated circuit device 50A may be tested before it is attached, suchthat only known good dies are used to form the device stack 102.

The topmost integrated circuit device 50A may be similar to theintegrated circuit device 50 discussed above with reference to FIG. 2A,except bonding pads 62 and conductive vias 64 may not be formed beforeadhesion to the first carrier substrate 104. As will be discussedfurther below, the device stack 102 is tested after formation. Becausethe topmost integrated circuit device 50A is at the topmost layer of thedevice stack 102, the testing pads 58 of the topmost integrated circuitdevice 50A will be used for device testing. The bonding pads 62 andconductive vias 64 of the topmost integrated circuit device 50A may beformed after testing, to prevent damage to the bonding pads 62 duringtesting.

In FIG. 2B, a topmost encapsulant 110A is formed around the topmostintegrated circuit device 50A and over the first carrier substrate 104.The topmost encapsulant 110A may be a molding compound, epoxy, or thelike, and may be applied by compression molding, transfer molding, orthe like. The topmost encapsulant 110A may be formed over the topmostintegrated circuit device 50A and first carrier substrate 104 such thatthey are buried or covered. The topmost encapsulant 110A is then cured.The topmost encapsulant 110A and topmost integrated circuit device 50Aare thinned by, e.g., a CMP, exposing the conductive vias 54 of thetopmost integrated circuit device 50A. After the thinning, surfaces ofthe topmost encapsulant 110A and conductive vias 54 are level with theback surface of the topmost integrated circuit device 50A.

In FIG. 2C, an intermediate integrated circuit device 50B is attached tothe topmost integrated circuit device 50A. In particular, the activesurface of the intermediate integrated circuit device 50B is attached tothe back surface of the topmost integrated circuit device 50A. Unlikethe topmost integrated circuit device 50A, the intermediate integratedcircuit device 50B does include the bonding pads 62 and conductive vias64 at the time of adhesion to the topmost integrated circuit device 50A.The intermediate integrated circuit device 50B may be tested before itis attached, such that only known good dies are used to form the devicestack 102.

In some embodiments, the integrated circuit devices 50A and 50B areattached by hybrid bonding. Before performing the bonding, a surfacetreatment may be performed on the integrated circuit devices 50A and50B. The surface treatment may be a plasma treatment process, and theprocess gas used for generating the plasma may be a hydrogen-containinggas, which includes a first gas including hydrogen (H₂) and argon (Ar),a second gas including H₂ and nitrogen (N₂), or a third gas including H₂and helium (He). Through the treatment, the number of OH groups at thesurface of the dielectric layer 60 increases. Next, a pre-bondingprocess may be performed, where the integrated circuit devices 50A and50B are aligned. The integrated circuit devices 50A and 50B are pressedagainst together to form weak bonds between the substrate 52 of thetopmost integrated circuit device 50A and the dielectric layer 60 of theintermediate integrated circuit device 50B. After the pre-bondingprocess, the integrated circuit devices 50A and 50B are annealed tostrengthen the weak bonds and form a fusion bond. During the annealing,the H of the OH bonds is outgassed, thereby forming Si—O—Si bondsbetween the integrated circuit devices 50A and 50B, therebystrengthening the bonds. During the hybrid bonding, directmetal-to-metal bonding also occurs between the conductive vias 54 of thetopmost integrated circuit device 50A and the bonding pads 62 of theintermediate integrated circuit device 50B. Accordingly, the resultingbond is a hybrid bond that includes the Si—O—Si bond and metal-to-metaldirect bond.

In FIG. 2D, an intermediate encapsulant 110B is formed around theintermediate integrated circuit device 50B and over the first carriersubstrate 104. The intermediate encapsulant 110B may be formed from amaterial selected from the candidate materials of the topmostencapsulant 110A, or may include a different material. The intermediateencapsulant 110B may be formed by a method selected from the candidatemethods of forming the topmost encapsulant 110A, or may be formed by adifferent method.

In FIG. 2E, the steps described above are repeated until the devicestack 102 includes a bottommost integrated circuit device 50C surroundedby a bottommost encapsulant 110C. The bottommost integrated circuitdevice 50C may not be thinned, such that the conductive vias 54 of thebottommost integrated circuit device 50C remain electrically insulated.The bottommost integrated circuit device 50C may be tested before it isattached, such that only known good dies are used to form the devicestack 102.

It should be appreciated that the device stack 102 may include anynumber of layers. In the embodiment shown, the device stack 102 includesthree layers. In another embodiment, the device stack 102 includes twoor more than three layers.

In FIG. 2F, the device stack 102 is removed from the first carriersubstrate 104, flipped, and attached to a second carrier substrate 112.In embodiments where the first carrier substrate 104 is a silicon waferand the bonding layer 106 is a dielectric layer, the removal may beaccomplished by etching or grinding away the silicon wafer anddielectric layer. In embodiments where the first carrier substrate 104is glass and the bonding layer 106 is a release layer, the removal maybe accomplished by projecting a light such as a laser light or an UVlight on the release layer so that the release layer decomposes underthe heat of the light and the glass is debonded. The second carriersubstrate 112 may be a silicon wafer, and the device stack 102 may beattached to the second carrier substrate 112 by bonding such asoxide-to-oxide bonding using a bonding layer 114. The bonding layer 114may be an oxide that is compatible with fusion bonding, such as siliconoxide. The bonding layer 114 may be applied to a back-side of the devicestack 102, such as to a back-side of the bottommost integrated circuitdevice 50C, or may be applied over the surface of the second carriersubstrate 112, such as by CVD or the like.

In FIG. 2G, the device stack 102 is tested by use of a probe 116. Thetesting pads 58 of the bottommost integrated circuit device 50C areexposed by patterning the dielectric layer 60 of the bottommostintegrated circuit device 50C to form openings 118. The dielectric layer60 may be patterned using suitable photolithography and etching methods.In some embodiments, a photoresist material (not shown) is formed overthe dielectric layer 60. The photoresist material is subsequentlyirradiated (exposed) and developed to remove a portion of thephotoresist material. Subsequently, exposed portions of the dielectriclayer 60 are removed using, for example, a suitable etching process toform the openings 118. The probe 116 is then physically and electricallyconnected to the testing pads 58 exposed by the openings 118. Thetesting pads 58 are used to test the device stack 102, such that onlyknown good device stacks are used for further processing. The testingmay include testing of the functionality of the various integratedcircuit devices, or may include testing for known open or short circuitsthat may be expected based on the design of the integrated circuitdevices. During the testing, all integrated circuit devices of thedevice stack 102 may be tested in a daisy-chain manner.

In FIG. 2H, the probe 116 is removed and the openings 118 are filled.The openings 118 may be filled by forming (e.g., depositing) moredielectric material of the dielectric layer 60 in the openings 118, andperforming a planarization such as a CMP to remove excess dielectricmaterial outside of the openings 118. The bonding pads 62 and conductivevias 64 are then formed in the dielectric layer 60 of the bottommostintegrated circuit device 50C using the techniques described above.Notably, the bonding pads 62 are different from the testing pads 58. Thetesting pads 58 may remain unused in the bottommost integrated circuitdevice 50C after testing is complete.

In FIG. 2I, a second integrated circuit device 120 is attached to thedevice stack 102, thereby forming the first device package 100. Thesecond integrated circuit device 120 may perform a different functionthan the integrated circuit devices 50A, 50B, and 50C. For example, theintegrated circuit devices 50A, 50B, and 50C may be memory devices, andthe second integrated circuit device 120 may be a logic device (e.g., acentral processing unit (CPU), graphics processing unit (GPU),system-on-a-chip (SoC), microcontroller, etc.). The second integratedcircuit device 120 may be attached to the bottommost integrated circuitdevice 50C by hybrid bonding, using the dielectric layer 60 and bondingpads 62 of the bottommost integrated circuit device 50C. An encapsulant121 is formed around the second integrated circuit device 120 and overthe device stack 102. The encapsulant 121 may be formed from a materialselected from the candidate materials of the topmost encapsulant 110A,or may include a different material. The encapsulant 121 may be formedby a method selected from the candidate methods for forming the topmostencapsulant 110A, or may be formed by a different method.

In FIG. 2J, the first device package 100 is tested by use of a probe122. The first device package 100 is tested using the testing pads 58 ofthe second integrated circuit device 120. Openings 124 may be formedexposing the testing pads 58 of the second integrated circuit device120, and the second integrated circuit device 120 may be tested using asimilar method as the method for testing the device stack 102. Thetesting may include testing of the functionality of the integratedcircuit devices of the first device package 100, or may include testingfor known open or short circuits that may be expected based on thedesign of the integrated circuit devices.

In FIG. 2K, the probe 122 is removed and the openings 124 are filled.The openings 124 may be filled using a similar method as the method forfilling the openings 118. Bumps 126 are then formed on the secondintegrated circuit device 120, and conductive connectors 128 are formedon the bumps 126.

The bumps 126 may be metal pillars, controlled collapse chip connection(C4) bumps, micro bumps, electroless nickel-electrolesspalladium-immersion gold technique (ENEPIG) formed bumps, ball gridarray (BGA) bumps, or the like. In an embodiment, the bumps 126 are C4bumps. The bumps 126 may be formed by a sputtering, printing, electroplating, electroless plating, CVD, or the like. The bumps 126 may besolder free and have substantially vertical sidewalls. In someembodiments, a metal cap layer (not shown) is formed on the top of thebumps 126. The metal cap layer may include nickel, tin, tin-lead, gold,silver, palladium, indium, nickel-palladium-gold, nickel-gold, the like,or a combination thereof and may be formed by a plating process.

The conductive connectors 128 may be formed from a conductive materialsuch as solder, copper, aluminum, gold, nickel, silver, palladium, tin,the like, or a combination thereof. In some embodiments, the conductiveconnectors 128 are formed by initially forming a layer of solder throughmethods such as evaporation, electroplating, printing, solder transfer,ball placement, or the like. Once a layer of solder has been formed onthe structure, a reflow may be performed in order to shape theconductive connectors 128 into desired bump shapes. In some embodiments,the bumps 126 and conductive connectors 128 may both be solder.

Once formation of the first device package 100 is complete, the firstdevice package 100 is singulated from adjacent device packages formed onthe same carrier wafer. The singulation may be by, e.g., a sawing orlaser cutting. The second carrier substrate 112 remains aftersingulation in some embodiments. As discussed further below, the secondcarrier substrate 112 may help with thermal dissipation of the firstdevice package 100. In some embodiments, the second carrier substrate112 may be removed, and optionally, other structures, such as coolingsystem, may be attached. In the embodiment shown, the conductive vias 54of the topmost integrated circuit device 50A are electrically isolatedin the first device package 100. Such conductive vias 54 may be unusedso that a same die may be used for stacking in the device stack 102.

In FIG. 2L, the second device package 150 is formed by mounting thefirst device package 100 to a package substrate 152. The packagesubstrate 152 may be made of a semiconductor material such as silicon,germanium, diamond, or the like. Alternatively, compound materials suchas silicon germanium, silicon carbide, gallium arsenic, indium arsenide,indium phosphide, silicon germanium carbide, gallium arsenic phosphide,gallium indium phosphide, combinations of these, and the like, may alsobe used. Additionally, the package substrate 152 may be a SOI substrate.Generally, an SOI substrate includes a layer of a semiconductor materialsuch as epitaxial silicon, germanium, silicon germanium, SOI, SGOI, orcombinations thereof. The package substrate 152 is, in one alternativeembodiment, based on an insulating core such as a fiberglass reinforcedresin core. One example core material is fiberglass resin such as FR4.Alternatives for the core material include bismaleimide-triazine BTresin, or alternatively, other PCB materials or films. Build up filmssuch as ABF or other laminates may be used for package substrate 152.

The package substrate 152 may include active and passive devices (notshown). A wide variety of devices such as transistors, capacitors,resistors, combinations of these, and the like, may be used to generatethe structural and functional requirements of the design for the seconddevice package 150. The devices may be formed using any suitablemethods.

The package substrate 152 may also include metallization layers and vias(not shown) and bond pads 154 over the metallization layers and vias.The metallization layers may be formed over the active and passivedevices and are designed to connect the various devices to formfunctional circuitry. The metallization layers may be formed ofalternating layers of dielectric (e.g., low-k dielectric material) andconductive material (e.g., copper) with vias interconnecting the layersof conductive material and may be formed through any suitable process(such as deposition, damascene, dual damascene, or the like). In someembodiments, the package substrate 152 is substantially free of activeand passive devices.

In some embodiments, the conductive connectors 128 are reflowed toattach the first device package 100 to the bond pads 154, therebybonding the second integrated circuit device 120 to the packagesubstrate 152. The conductive connectors 128 electrically and/orphysically couple the package substrate 152, including metallizationlayers in the package substrate 152, to the first device package 100. Insome embodiments, passive devices (e.g., surface mount devices (SMDs),not illustrated) may be attached to the second device package 150 (e.g.,bonded to the bond pads 154) prior to mounting on the package substrate152. In such embodiments, the passive devices may be bonded to a samesurface of the second device package 150 as the conductive connectors128.

The conductive connectors 128 may have an epoxy flux (not shown) formedthereon before they are reflowed with at least some of the epoxy portionof the epoxy flux remaining after the second device package 150 isattached to the package substrate 152. This remaining epoxy portion mayact as an underfill to reduce stress and protect the joints resultingfrom the reflowing the conductive connectors 128.

An underfill (not shown) may be formed between the second integratedcircuit device 120 and the package substrate 152, surrounding theconductive connectors 128. The underfill may be formed by a capillaryflow process after the first device package 100 is attached or may beformed by a suitable deposition method before the first device package100 is attached.

FIG. 3 is a cross-sectional view of a dummy device 300, in accordancewith some embodiments. The dummy device 300 does not perform anelectrical function, and has no active or passive devices formedtherein. Rather, as will be discussed further below (e.g., with respectto the embodiment of FIGS. 5A through 5J and the embodiment of FIGS. 9Athrough 9H), the dummy device 300 may be included with embodiment devicepackages (e.g., the device packages 550 and 950, see below) to improvethe thermal dissipation of the resulting packages. The dummy device 300includes a substrate 302, an isolation film 304, an etch stop layer 306,an inter-metal dielectric (IMD) layer 308, an alignment mark 310, and abonding film 312.

The isolation film 304 is formed on the substrate 302. The substrate 302may be formed from a material selected from the candidate materials ofthe substrate 52, or may include a different material. The substrate 302may be formed by a method selected from the candidate methods of formingthe substrate 52, or may be formed by a different method. The isolationfilm 304 helps electrically isolate the alignment mark 310. Theisolation film 304 may be formed from a dielectric material such assilicon carbide, silicon nitride, or the like, and may be formed by CVD,PVD, or the like. In an embodiment, the isolation film 304 is formed toa thickness of less than about 5 kÅ.

The etch stop layer 306 is formed on the isolation film 304. The etchstop layer 306 may be formed from silicon carbide, silicon nitride,silicon oxynitride, silicon carbo-nitride, or the like. The etch stoplayer 306 may be formed by chemical vapor deposition (CVD), physicalvapor deposition (PVD), atomic layer deposition (ALD), aspin-on-dielectric process, the like, or a combination thereof. In anembodiment, the etch stop layer 306 is formed to a thickness of fromabout 500 Å to about 2 kÅ.

The IMD layer 308 is formed over the etch stop layer 306. The IMD layer308 may be a layer formed from a low-k dielectric material having ak-value lower than about 3.0. The IMD layer 308 may be from anextra-low-k (ELK) dielectric material having a k-value of less than 2.5.In some embodiments, the IMD layer 308 may be formed from Black Diamond(a registered trademark of Applied Materials), an oxygen-containingand/or carbon containing low-k dielectric material, HydrogenSilsesQuioxane (HSQ), MethylSilsesQuioxane (MSQ), or the like. The IMDlayer 308 may be a porous material. The IMD layer 308 may also be from adielectric material such as silicon nitride, silicon oxide, or the like.In an embodiment, the IMD layer 308 is formed to a thickness of fromabout 2 kÅ to about 8 kÅ. In some embodiments, the materials of the etchstop layer 306 and the IMD layer 308 are selected to achieve a highetching selectivity between the etch stop layer 306 and the IMD layer308, and hence the etch stop layer 306 may be used to stop the etchingof the IMD layer 308 in subsequent processing steps.

The alignment mark 310 is formed in the IMD layer 308, and may extendthrough the etch stop layer 306 and isolation film 304. The alignmentmark 310 may be formed using a single damascene process. As an exampleto form the alignment mark 310, an opening (not shown) may be formed inthe IMD layer 308 by an etching process. The etching process may removematerial of the IMD layer 308 and may not remove material of the etchstop layer 306. Once the etch stop layer 306 is exposed, a differentetching process may be performed to extend the opening through the etchstop layer 306. The opening may also be extended at least partially intothe isolation film 304. One or more diffusion barrier layers (not shown)is optionally formed in the opening, and a conductive material is thenformed over the diffusion barrier layers, if present. The diffusionbarrier layers may be formed from TaN, Ta, TiN, Ti, CoW, or the like,and may be formed in the openings by a deposition process such as ALD orthe like. The conductive material may include copper, aluminum,tungsten, silver, and combinations thereof, or the like, and may beformed over the diffusion barrier layers in the openings by anelectro-chemical plating process, CVD, ALD, PVD, the like, or acombination thereof. In an embodiment, the conductive material iscopper, and the diffusion barrier layers are thin barrier layers thatprevent the copper from diffusing into the IMD layer 308. Afterformation of the diffusion barrier layers and the conductive material,excess of the diffusion barrier layers and conductive material may beremoved by, for example, a planarization process such as a CMP.

The bonding film 312 is formed on the alignment mark 310 and IMD layer308. The bonding film 312 is used for bonding such as oxide-to-oxidebonding in subsequent steps, and is formed from a material that may beused to form oxide-to-oxide bonds with a semiconductor substrate. In anembodiment, the bonding film 312 is formed from an oxide such as siliconoxide, and may be formed using CVD, PVD, ALD, a spin-on coating process,a combination thereof, or the like. In an embodiment, the bonding film312 is formed to a thickness of from about 0.8 μm to about 2 μm.

FIGS. 4A through 4D are plan views of the alignment mark 310, inaccordance with various embodiments. As shown, the alignment mark 310may be formed to have a variety of shapes in a plan view. For example,the alignment mark 310 may have a closed square shape (see FIG. 4A), around shape (see FIG. 4B), a cross shape (see FIG. 4C), or an opensquare shape (see FIG. 4D). It should be appreciated that other shapesmay also be used.

FIGS. 5A through 5J are various cross-sectional views of intermediatesteps during a process for forming device packages, in accordance withsome embodiments. In FIGS. 5A through 5J, a device stack 502 is formedby stacking multiple dummy devices (such as the dummy device 300described above with reference to FIGS. 3 and 4) and first integratedcircuit devices (such as the integrated circuit devices 50 describedabove with reference to FIG. 1). The device stack 502 is tested afterformation. Subsequent device packages are then formed with the devicestack 502. Forming the device stack 502 with the dummy devices 300 mayhelp with heat dissipation of the resulting device packages. Further,the alignment marks 310 in the dummy devices 300 may improve devicestacking accuracy in subsequent processing. The device packages may beCoW or CoWoS packages, although it should be appreciated thatembodiments may be applied to other 3DIC packages.

Referring first to FIG. 5A, multiple topmost integrated circuit devices50A and dummy devices 300A are adhered to a first carrier substrate 508.In some embodiments, the topmost integrated circuit devices 50A lackbonding pads at the time of adhesion to the first carrier substrate 508.The topmost integrated circuit devices 50A may be tested before they areattached, such that only known good dies are used to form the devicestack 502.

The first carrier substrate 508 may be formed from a silicon wafer orthe like, and alignment marks 510 are formed in or over the siliconwafer. The alignment marks 510 may be formed in a similar manner as thealignment marks 310 of the dummy devices 300A.

The topmost integrated circuit devices 50A and dummy devices 300A areplaced face-down on the first carrier substrate 508 and are adheredusing bonding such as oxide-to-oxide bonding with, respectively, thedielectric layers 60 and bonding films 312. The placement may be by,e.g., a pick-and-place process. During placement, the alignment marks310 of the dummy devices 300A are aligned with alignment marks 510 ofthe first carrier substrate 508, which may allow for more accurateplacement during the pick-and-place process. Corners of the topmostintegrated circuit devices 50A may be aligned during the pick-and-place.In some embodiments, the integrated circuit devices 50A are placedbefore the dummy devices 300A. In some embodiment, the dummy devices300A are placed before the integrated circuit devices 50A. Details abouthow the alignment marks 310 may be used will be discussed in furtherdetail below.

In FIG. 5B, a topmost encapsulant 514A is formed around the topmostintegrated circuit devices 50A, around the dummy devices 300A, and overthe first carrier substrate 508. The topmost encapsulant 514A may beformed from a material selected from the candidate materials of thetopmost encapsulant 110A (see FIG. 2B), or may include a differentmaterial. The topmost encapsulant 514A may be formed by a methodselected from the candidate methods of forming the topmost encapsulant110A, or may be formed by a different method. The topmost encapsulant514A, topmost integrated circuit devices 50A, and dummy devices 300A arethinned by, e.g., a CMP, thereby exposing the conductive vias 54 of thetopmost integrated circuit devices 50A.

In FIG. 5C, the steps described above are repeated to form additionallayers of the device stack 502. Intermediate integrated circuit devices50B and dummy devices 300B are attached to the topmost integratedcircuit devices 50A and dummy devices 300A. Likewise, bottommostintegrated circuit devices 50C and dummy devices 300C are attached tothe intermediate integrated circuit devices 50B and dummy devices 300B.The intermediate integrated circuit devices 50B and bottommostintegrated circuit devices 50C include the bonding pads 62 at the timeof adhesion. As such, the integrated circuit devices of each layer areattached to the underlying layer by hybrid bonding. Each of theintegrated circuit devices may be tested before they are attached, suchthat only known good dies are used to form the device stack 502.

It should be appreciated that the device stack 502 may include anynumber of layers. In the embodiment shown, the device stack 502 includesfour layers (e.g., topmost integrated circuit devices 50A and dummydevices 300A; two layers of intermediate integrated circuit devices 50Band dummy devices 300B; and bottommost integrated circuit devices 50Cand dummy devices 300C). In another embodiment, the device stack 502includes a greater or lesser number of layers, such as five layers ortwo layers.

In FIG. 5D, a second carrier substrate 516 is attached to the devicestack 502 by bonding such as oxide-to-oxide bonding using a bondinglayer 518. The second carrier substrate 516 may be formed from a siliconwafer or the like, and alignment marks 520 are formed in or over thesilicon wafer. The alignment marks 520 may be formed in a similar manneras the alignment marks 310 of the dummy devices 300A. The alignmentmarks 520 of the second carrier substrate 516 are aligned with alignmentmark 310 of the dummy devices 300A, 300B, and 300C such that the secondcarrier substrate 516 may be more accurately placed. The bonding layer518 may be formed from a material selected from the candidate materialsof the bonding layer 114, or may include a different material. Thebonding layer 518 may be formed by a method selected from the candidatemethods of forming the bonding layer 114 (see FIG. 2F), or may be formedby a different method. In an embodiment, the bonding layer 518 is anoxide that is compatible with oxide-to-oxide bonding, such as siliconoxide.

In FIG. 5E, the device stack 502 is removed from the first carriersubstrate 508 and flipped. In embodiments where the first carriersubstrate 508 is a silicon wafer and the bonding layer 518 is adielectric layer, the removal may be accomplished by etching or grindingaway the silicon wafer and dielectric layer. The device stack 502 maythen be tested, such that only known good device stacks are used forfurther processing. Similar to the device stack 102, the topmostintegrated circuit devices 50A may include test pads (not shown), whichare used for testing. The test pads may be exposed for testing, and thencovered after testing such that they are electrically isolated. The testpads may be formed from a different material than the bonding pads 62.

In FIG. 5F, the bonding pads 62 are formed in the dielectric layer 60 ofthe topmost integrated circuit devices 50A. The bonding pads 62 may beformed by a dual damascene process after testing. Notably, the bondingpads 62 are different from the testing pads 58 (not shown in FIG. 5F,but shown above in FIG. 1).

In FIG. 5G, second integrated circuit devices 522 are attached to thedevice stack 502 by hybrid bonding with the bonding pads 62 of thetopmost integrated circuit devices 50A, thereby forming first devicepackages 500. The second integrated circuit device 120 may perform adifferent function than the integrated circuit devices 50A, 50B, and50C. Before attachment, the second integrated circuit devices 522 may betested, such that only known good dies are used to form the first devicepackages 500.

An encapsulant 524 is formed around the second integrated circuitdevices 522. The encapsulant 524 may be formed from a material selectedfrom the candidate materials of the topmost encapsulant 110A (see FIG.2B), or may include a different material. The encapsulant 524 may beformed by a method selected from the candidate methods of forming thetopmost encapsulant 110A, or may be formed by a different method. Theencapsulant 524 and second integrated circuit devices 522 are thinnedby, e.g., a CMP, such that they have level surfaces.

In FIG. 5H, openings are formed in the dielectric layers 60 of thesecond integrated circuit devices 522, and bumps 526 are formed in theopenings. The bumps 526 may be formed from a material selected from thecandidate materials of the bumps 126 (see FIG. 2K), or may include adifferent material. The bumps 526 may be formed by a method selectedfrom the candidate methods of forming the bumps 126, or may be formed bya different method.

Conductive connectors 528 are then formed on the bumps 526. Theconductive connectors 528 may be formed from a material selected fromthe candidate materials of the conductive connectors 128 (see FIG. 2K),or may include a different material. The conductive connectors 528 maybe formed by a method selected from the candidate methods of forming theconductive connectors 128, or may be formed by a different method. Thefirst device packages 500 may then be tested by a probe, using theconductive connectors 528, such that only known good devices are usedfor further processing.

In FIG. 5I, the first device packages 500 are singulated from adjacentdevice packages. The singulation may be by, e.g., a sawing or lasercutting along scribe lines 530. Although it is not shown, it should beappreciated that the alignment marks 520 of the second carrier substrate516 may be disposed along the scribe lines 530. As such, the singulationprocess may result in some of the alignment marks 520 being cut orremoved, such that portions of the second carrier substrate 516 in thefirst device packages 500 have fragments or portions of the alignmentmarks 520.

In FIG. 5J, second device packages 550 are formed by mounting the firstdevice packages 500 to a package substrate 552. The package substrate552 may be similar to the package substrate 152 (see FIG. 2L). Thepackage substrate 552 may include metallization layers and vias (notshown) and bond pads 554 over the metallization layers and vias. Theconductive connectors 528 of the first device packages 500 are coupledto the bond pads 554 of the package substrate 552 to form the seconddevice packages 550.

The dummy devices 300A, 300B, and 300C may form a thermal pathwaybetween the second integrated circuit devices 522 and the second carriersubstrate 516. As such, the heat dissipation of the resulting seconddevice packages 550 may be improved. Further, by forming the alignmentmarks 310 in the dummy devices 300A, 300B, and 300C, alignment marks maybe omitted from the integrated circuit devices 50A, 50B, and 50C. Theavailable routing area in the various integrated circuit devices maythus be increased.

FIGS. 6A and 6B illustrate variations of the second device package 550,in accordance with various embodiments. In a first variation (e.g., FIG.6A), the dummy devices may be omitted. As such, only the second carriersubstrate 516 includes alignment marks 520 in the second device packages550. During formation, the alignment marks 520 of the second carriersubstrate 516 may be aligned with the alignment marks 510 (see FIG. 5D)of the first carrier substrate 508. In a second variation (e.g., FIG.6B), the dummy devices 300 and alignment marks 310 may be omitted. Theillustrated variations may have lower manufacturing costs.

FIGS. 7A through 7C are top-down views showing the device stack 502 atdifferent stages of manufacturing, in accordance with variousembodiments. In the example shown, FIG. 7A may correspond to placementof the topmost integrated circuit devices 50A (shown in FIG. 5A), FIG.7B may correspond to placement of the topmost dummy devices 300A (shownin FIG. 5A), and FIG. 7C may correspond to placement of the intermediateintegrated circuit devices 50B and dummy devices 300B (shown in FIG.5C). Use of the alignment marks 310 and 510 is illustrated. In FIG. 7A,a first layer of integrated circuit device 50 is placed over the firstcarrier substrate 508. The alignment marks 510 of the first carriersubstrate 508 are disposed between the integrated circuit devices 50. InFIG. 7B, a first layer of dummy devices 300 is disposed over the firstcarrier substrate 508 between the integrated circuit devices 50. Thealignment marks 310 of the first layer of dummy devices 300 are alignedwith a first subset 510A of the alignment marks 510. In FIG. 7C, asecond layer of integrated circuit device 50 and dummy devices 300 isplaced on the first layer. The alignment marks 310 of the second layerof dummy devices 300 are aligned with a second subset 510B of thealignment marks 510. The material of the dummy devices 300 istransparent to the light used for aligning the alignment marks 310.Further, the first subset 510A and second subset 510B of the alignmentmarks 510 may have different shapes (see, e.g., FIGS. 4A through 4D).For example, the dummy devices 300 of a first layer may be aligned withunderlying alignment marks 510 having a first shape, and the dummydevices 300 of a second layer may be aligned with underlying alignmentmarks 510 having a second shape. Further, some of the dummy devices 300may have multiple laterally offset alignment marks 310 (see FIG. 7C), toensure the dummy devices 300 are properly rotated during alignment.Further, the alignment marks 310 of the dummy devices 300 in differentlayers do not overlap in a plan or top-down view.

FIGS. 8A through 8C are plan views of one of the layers of a firstdevice package 500 (see, e.g., FIGS. 5A through 5I), in accordance withsome embodiments. The layout of the dummy devices 300 is shown relativeto the integrated circuit device 50. The dummy devices 300 may be laidout in several manners, and may have several shapes. In some embodiments(e.g., FIG. 8A), the dummy devices 300 are laid out along two edges ofthe integrated circuit device 50. In some embodiments (e.g., FIG. 8B),the dummy devices 300 are laid out along four edges of the integratedcircuit device 50. In some embodiments (e.g., FIG. 8C), a single dummydevice 300 surrounds the integrated circuit device 50. Other dummydevice layouts are also possible.

FIGS. 9A through 9H are various cross-sectional views of intermediatesteps during a process for forming device packages, in accordance withsome embodiments. In FIGS. 9A through 9H, a device stack 902 is formedby stacking multiple dummy devices and first integrated circuit deviceson a second integrated circuit device. The first integrated circuitdevices may have structures similar to the integrated circuit device 50(see FIG. 1), and in an embodiment may be memory dies. The secondintegrated circuit devices may have structures similar to the integratedcircuit device 50 (see FIG. 1), and in an embodiment may be logic dies.The dummy devices may have structures similar to the dummy devices 300(see FIG. 3). The device stack 902 is tested after formation.

In FIG. 9A, first integrated circuit devices 904 are attached to a firstcarrier substrate 906. The first carrier substrate 906 may be formedfrom a silicon wafer or the like, and alignment marks 908 are formed inor over the silicon wafer. The alignment marks 908 may be formed in asimilar manner as the alignment marks 310 of the dummy devices 300 (seeFIG. 3). The first integrated circuit devices 904 may be placed on thefirst carrier substrate 906 and attached by bonding such asoxide-to-oxide bonding using the dielectric layers 60 of the firstintegrated circuit devices 904. The first integrated circuit devices 904may be tested before they are attached, such that only known good diesare used for processing.

In FIG. 9B, a first encapsulant 912 is formed around the firstintegrated circuit devices 904. The first encapsulant 912 may be formedfrom a material selected from the candidate materials of the topmostencapsulant 110A (see FIG. 2B), or may include a different material. Thefirst encapsulant 912 may be formed by a method selected from thecandidate methods of forming the topmost encapsulant 110A, or may beformed by a different method. The first encapsulant 912 and firstintegrated circuit devices 904 are thinned by, e.g., a CMP, exposing theconductive vias 54 of the first integrated circuit devices 904.

In FIG. 9C, the device stack 902 is formed on the first integratedcircuit devices 904. The device stack 902 includes multiple layers ofintegrated circuit devices 50A-50D, dummy devices 300A-300D, andencapsulants 918A-918D. A bottommost layer of the integrated circuitdevices 50D and dummy devices 300D may not be planarized, such that theconductive vias 54 of the integrated circuit devices 50D remaininsulated. Each layer may be attached using, e.g., bonding such asoxide-to-oxide bonding. During placement, the alignment marks 310 of thedummy devices 300A-300D are aligned with the alignment marks 908 of thefirst carrier substrate 906.

In FIG. 9D, a second carrier substrate 920 is attached to the devicestack 902 by bonding such as oxide-to-oxide bonding using a dielectriclayer 922, thereby forming first device packages 900. The second carriersubstrate 920 may be formed from a material selected from the candidatematerials of the second carrier substrate 112, or may include adifferent material. The second carrier substrate 920 includes alignmentmarks 924 which are aligned with the alignment marks 310 of theintegrated circuit devices 50A-50D during placement.

In FIG. 9E, the first carrier substrate 906 is removed from the firstintegrated circuit devices 904. In embodiments where the first carriersubstrate 906 is a silicon wafer, the removal may be accomplished byetching or grinding away the silicon wafer and dielectric layer.

In FIG. 9F, openings are formed in the dielectric layers 60 of the firstintegrated circuit devices 904, and bumps 926 are formed in theopenings. The bumps 926 may be formed from a material selected from thecandidate materials of the bumps 126 (see FIG. 2K), or may include adifferent material. The bumps 926 may be formed by a method selectedfrom the candidate methods of forming the bumps 126, or may be formed bya different method.

Conductive connectors 928 are then formed on the bumps 926. Theconductive connectors 928 may be formed from a material selected fromthe candidate materials of the conductive connectors 128, or may includea different material. The conductive connectors 928 may be formed by amethod selected from the candidate methods of forming the conductiveconnectors 128, or may be formed by a different method. The first devicepackages 900 may then be tested by a probe, using the conductiveconnectors 928, such that only known good devices are used for furtherprocessing.

In FIG. 9G, the first device packages 900 are singulated from adjacentdevice packages. The singulation may be by, e.g., a sawing or lasercutting along scribe lines 930. The alignment marks 924 of the secondcarrier substrate 920 may be disposed along the scribe lines 930. Assuch, the singulation process may result in some of the alignment marks924 being cut or removed, such that portions of the second carriersubstrate 920 in the first device packages 900 have fragments orportions of the alignment marks 924.

In FIG. 9H, second device packages 950 are formed by mounting the firstdevice packages 900 to a package substrate 952. The package substrate952 may be similar to the package substrate 152 (see FIG. 2L). Thepackage substrate 952 may include metallization layers and vias (notshown) and bond pads 954 over the metallization layers and vias. Theconductive connectors 928 of the first device packages 900 are coupledto the bond pads 954 of the package substrate 952 to form the seconddevice packages 950.

Embodiments may achieve advantages. By testing the device stacks (suchas memory cubes) before further processing, known good cubes may be usedfor processing, increasing device package yield. Further, use of thedummy devices in the device packages may improve the thermal performanceof the resulting device packages. Finally, placing the alignment marksin the dummy devices may allow alignment marks to be omitted from thedevices in the memory cube, which may increase the routing area of thedevices in the memory cube.

In an embodiment, a method includes: stacking a plurality of first diesto form a device stack; revealing testing pads of a topmost die of thedevice stack; testing the device stack using the testing pads of thetopmost die; and after testing the device stack, forming bonding pads inthe topmost die, the bonding pads being different from the testing pads.

In some embodiments, the method further includes: after testing thedevice stack, covering the test pads of the topmost die. In someembodiments of the method, stacking the plurality of first diesincludes: bonding the topmost die to a first carrier substrate, whereduring the bonding, the topmost die includes a dielectric layer over thetesting pads, and is free from bonding pads; and stacking a bottommostdie over the topmost die, where during the stacking, the bottommost dieincludes bonding pads and a dielectric layer over the bonding pads. Insome embodiments of the method, bonding the topmost die to the firstcarrier substrate includes forming oxide-to-oxide bonds with thedielectric layer of the topmost die, and stacking the bottommost dieover the topmost die includes performing hybrid bonding with the bondingpads and the dielectric layer of the bottommost die. In some embodimentsof the method, stacking the plurality of first dies further includes:encapsulating the topmost die with a topmost encapsulant layer; andafter encapsulating the topmost die, encapsulating the bottommost diewith a bottommost encapsulant layer. In some embodiments of the method,stacking the plurality of first dies further includes: encapsulating atopmost dummy device with the topmost encapsulant layer; and afterencapsulating the topmost dummy device, encapsulating a bottommost dummydevice with the bottommost encapsulant layer. In some embodiments, themethod further includes: forming alignment marks in the topmost dummydevice and the bottommost dummy device. In some embodiments, the methodfurther includes: forming alignment marks in the first carriersubstrate; and aligning the alignment marks of the topmost andbottommost dummy devices with the alignment marks of the first carriersubstrate. In some embodiments, the method further includes: bonding thebottommost die of the device stack to a second carrier substrate; andremoving the device stack from the first carrier substrate. In someembodiments, the method further includes: bonding a second die to thetopmost die of the device stack using the bonding pads.

In an embodiment, a method includes: bonding a first die to a firstcarrier substrate; stacking a plurality of second dies and a pluralityof dummy devices on the first die to form a device stack; bonding asecond carrier substrate to the plurality of second dies and theplurality of dummy devices of the device stack; removing the firstcarrier substrate from the first die; forming conductive bumps on thefirst die; testing the first die and the device stack using theconductive bumps of the first die; and singulating the second carriersubstrate and portions of the dummy devices to form a first devicepackage.

In some embodiments of the method, the first carrier substrate includesfirst alignment marks, where the dummy devices include second alignmentmarks, and further including: aligning the second alignment marks of theplurality of dummy devices with the first alignment marks of the firstcarrier substrate when stacking the dummy devices on the first die. Insome embodiments of the method, the second carrier substrate includesthird alignment marks, and further including: aligning the thirdalignment marks of the second carrier substrate with the secondalignment marks of the plurality of dummy devices when bonding thesecond carrier substrate to the dummy devices. In some embodiments ofthe method, a first subset of the second alignment marks have a firstshape, and a second subset of the second alignment marks have a secondshape, the first and second subsets of the alignment marks beingdisposed in different layers of the device stack. In some embodiments ofthe method, singulating the portions of the dummy devices includescutting the second alignment marks during singulation. In someembodiments, the method further includes: aligning the first die and thesecond dies over the first carrier substrate without use of alignmentmarks.

In an embodiment, a device includes: a first die having a firstfunction; a device stack on the first die, the device stack including aplurality of layers, each of the layers including: a second die having asecond function; a dummy device adjacent the second die, the dummydevice including alignment marks; and an encapsulant disposed betweenthe dummy device and the second die; and a first substrate on the devicestack, the first substrate including alignment marks.

In some embodiments of the device, the dummy device of each of thelayers includes alignment marks. In some embodiments of the device, thealignment marks in different ones of the layers have different shapes.In some embodiments of the device, the alignment marks of the dummydevices in each of the layers do not overlap in a plan view.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method comprising: bonding a first die to afirst carrier substrate; stacking a plurality of second dies and aplurality of dummy devices on the first die to form a device stack;bonding a second carrier substrate to the plurality of second dies andthe plurality of dummy devices of the device stack; removing the firstcarrier substrate from the first die; forming conductive bumps on thefirst die; testing the first die and the device stack using theconductive bumps of the first die; and singulating the second carriersubstrate and portions of the dummy devices to form a first devicepackage.
 2. The method of claim 1, wherein the first carrier substratecomprises first alignment marks, wherein the dummy devices comprisesecond alignment marks, and further comprising: aligning the secondalignment marks of the plurality of dummy devices with the firstalignment marks of the first carrier substrate when stacking the dummydevices on the first die.
 3. The method of claim 2, wherein the secondcarrier substrate comprises third alignment marks, and furthercomprising: aligning the third alignment marks of the second carriersubstrate with the second alignment marks of the plurality of dummydevices when bonding the second carrier substrate to the dummy devices.4. The method of claim 3, wherein a first subset of the second alignmentmarks have a first shape, and a second subset of the second alignmentmarks have a second shape, the first and second subsets of the secondalignment marks being disposed in different layers of the device stack.5. The method of claim 2, wherein singulating the portions of the dummydevices comprises cutting the second alignment marks during singulation.6. The method of claim 1 further comprising: aligning the first die andthe second dies over the first carrier substrate without use ofalignment marks.
 7. A method comprising: bonding a logic device to afirst carrier substrate, the first carrier substrate comprising firstalignment marks; bonding a first memory device to the logic device;bonding a first dummy device to the logic device adjacent the firstmemory device, the first dummy device comprising second alignment marks,wherein bonding the first dummy device comprises aligning the secondalignment marks with a first subset of the first alignment marks;bonding a second memory device to the first memory device; bonding asecond dummy device to the first dummy device adjacent the second memorydevice, the second dummy device comprising third alignment marks,wherein bonding the second dummy device comprises aligning the thirdalignment marks with a second subset of the first alignment marks;removing the first carrier substrate from the logic device; afterremoving the first carrier substrate, testing the logic device, thefirst memory device, and the second memory device; and after testing thelogic device, the first memory device, and the second memory device,bonding the logic device to a package substrate.
 8. The method of claim7, wherein the first dummy device is one of a plurality of first dummydevices bonded to the logic device, the plurality of first dummy devicesbeing disposed along two edges of the first memory device.
 9. The methodof claim 7, wherein the first dummy device is one of a plurality offirst dummy devices bonded to the logic device, the plurality of firstdummy devices being disposed along four edges of the first memorydevice.
 10. The method of claim 7, wherein the first dummy device is asingle dummy device surrounding four edges of the first memory device.11. The method of claim 7, wherein the second alignment marks and thethird alignment marks do not overlap in a plan view.
 12. The method ofclaim 7, wherein the second alignment marks have a different shape thanthe third alignment marks.
 13. The method of claim 7 further comprising:forming conductive bumps on the logic device, wherein the logic device,the first memory device, and the second memory device are tested usingthe conductive bumps, and wherein the logic device is bonded to thepackage substrate using the conductive bumps.
 14. The method of claim 7further comprising: singulating portions of the first dummy device andthe second dummy device to form a device package.
 15. The method ofclaim 14, wherein singulating portions of the first dummy device and thesecond dummy device comprises cutting the second alignment marks and thethird alignment marks during singulation.
 16. The method of claim 7further comprising: bonding a second carrier substrate to the secondmemory device and the second dummy device, the second carrier substratecomprising fourth alignment marks, wherein bonding the second carriersubstrate comprises aligning the fourth alignment marks with a thirdsubset of the first alignment marks.
 17. A method comprising: bonding afirst die to a first carrier substrate, the first die having a firstfunction; stacking second dies and dummy devices on the first die, eachof the second dies having a second function; removing the first carriersubstrate from the first die to expose an active surface of the firstdie; forming conductive bumps at the active surface of the first die;testing the first die and the second dies using the conductive bumps;and singulating the first die and portions of the dummy devices to forma first device package.
 18. The method of claim 17 further comprising:before removing the first carrier substrate, bonding a second carriersubstrate to the second dies and the dummy devices.
 19. The method ofclaim 17, wherein the dummy devices comprise alignment marks, andsingulating the portions of the dummy devices comprises cutting thealignment marks.
 20. The method of claim 17, wherein the first die is alogic die, and stacking the second dies comprises: placing a firstmemory die above the logic die, the first memory die comprising firstconductive vias; encapsulating the first memory die with a firstencapsulant; thinning the first encapsulant and the first memory die toexpose the first conductive vias; placing a second memory die above thefirst memory die, the second memory die comprising second conductivevias; and encapsulating the second memory die with a second encapsulant,the second encapsulant and the second memory die not being thinned.